| Item | Specification |
|---|
| Material Type | Pure Copper (Cu), CuCrZr Alloy, CuSn Bronze, CuNi Alloy, Brass Alloy |
| Manufacturing Process | Gas Atomization / Water Atomization / Plasma Atomization |
| Particle Size Distribution | 15-53 μm / 20-63 μm (Customized Available) |
| Particle Morphology | Highly Spherical Powder Particles |
| Powder Flowability | Excellent Flowability for Metal Additive Manufacturing |
| Apparent Density | High Packing Density |
| Oxygen Content | ≤0.05-0.10% (Depending on Material Grade) |
| Chemical Composition | Controlled Alloy Composition According to Standards |
| Powder Purity | High Purity with Low Impurity Content |
| Printing Processes | SLM / LPBF / DMLS / DED |
| Surface Quality | Smooth Particle Surface with Low Satellite Powder Content |
| Application Fields | Aerospace, Thermal Management, Electronics, Automotive, Industrial Components |
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